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This vacuum laminator uses vacuum to bond films without bubbles on build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
Air-free, hassle-free laminator
Laminating in a vacuum makes it difficult for bubbles to form in the workpiece. It is ideal for attaching film to workpieces, such as fine patterns, where bubbles are prone to occur.
Ideal for bonding various film materials to flat and curved surfaces! Compact and lightweight with bonding quality comparable to production machines.
This product is a vacuum laminator that holds the film substrate in a vacuum using an adhesive mesh mechanism and attaches it to curved or flat cover glass or resin without bubbles. It is compact and lightweight, achieving bonding quality comparable to production machines. It is suitable for bonding various film materials to flat and curved surfaces. Additionally, the bonding operation is automatically controlled by PLC. 【Features】 - Holds the film substrate in a vacuum using an adhesive mesh mechanism - Attaches to curved or flat cover glass or resin without bubbles - Bonding operation is automatically controlled by PLC - Heater can be built into the lower stage (optional) *For more details, please refer to the PDF materials or feel free to contact us.
Handled by MCK Corporation,
Introducing the FPC・COF vacuum laminator (roll type).
Ideal for laminating FPC reinforcement plates, cover layers, and aluminum heat dissipation plates for PDPs!
The "Vacuum Laminator" is a product consisting of a table that moves back and forth driven by a motor and a heating plate for pressurization. Its main purpose is for various laminating applications, but it has proven particularly effective for laminating FPC reinforcement plates, cover layers, and aluminum heat dissipation plates for PDPs. Additionally, it can be applied to the attachment of electromagnetic wave shielding to rigid flex circuits. 【Features】 ■ The control circuit is integrated into the control panel located at the bottom of the main unit. ■ It allows for cycle-up with Hot to Hot, contributing to cost reduction. ■ The heating plate temperature can be used between 50°C and 180°C. ■ Both the vacuum draw time and press time can be set arbitrarily from 1 to 9999 seconds. *For more details, please refer to the PDF document or feel free to contact us.
UV (heating) vacuum press device / vacuum laminator
This is a vacuum press device that supports cutting-edge technologies such as sealing for organic EL displays, organic EL lighting, and solar cells. - Maximum substrate size: 730mm × 920mm - Vacuum double chamber system - Precision processing with film or sheet - UV irradiation function - Heating function Demo units are also available. We can accommodate experiments and prototypes. Please contact us for more details.
